Chemical content 74LVC1G175GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G175GV-Q100SOT457SC-7410.67115 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301506125412601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14057
PolymerResin systemProprietary0.0050025.000000.04686
DieDoped siliconSilicon (Si)7440-21-30.11941100.000001.11902
Lead FrameCopper alloyCopper (Cu)7440-50-83.3491597.0768031.38509
Iron (Fe)7439-89-60.074182.150000.69510
Phosphorus (P)7723-14-00.000520.015200.00491
Zinc (Zn)7440-66-60.002000.058000.01875
Pure metal layerSilver (Ag)7440-22-40.024150.700000.22631
Mould CompoundFillerSilica fused60676-86-04.6292071.0000043.38052
PigmentCarbon black1333-86-40.019560.300000.18330
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2844419.7000012.03657
Phenolic resinProprietary0.586809.000005.49894
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00015
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.87246
WireGold alloyGold (Au)7440-57-50.0413299.000000.38719
Palladium (Pd)7440-05-30.000421.000000.00391
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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