Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G175GW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G175GW-Q100SOT363-2SC-885.76893 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353015071257126030 s123520 s3Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12754
PolymerResin systemProprietary0.0024525.000000.04251
subTotal0.00981100.000000.17005
DieDoped siliconSilicon (Si)7440-21-30.11941100.000002.06992
subTotal0.11941100.000002.06992
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.41946
Iron (Fe)7439-89-60.048742.310000.84489
Lead (Pb)7439-92-10.000210.010000.00366
Phosphorus (P)7723-14-00.001480.070000.02560
Zinc (Zn)7440-66-60.002530.120000.04389
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23774
subTotal2.11000100.0000036.57524
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.62013
Silica fused60676-86-02.2159070.5700038.41090
PigmentCarbon black1333-86-40.006280.200000.10886
PolymerEpoxy resin systemProprietary0.291719.290005.05650
Phenolic resinProprietary0.186525.940003.23311
subTotal3.14000100.0000054.42950
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.41303
subTotal0.37000100.000006.41366
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0197099.990000.34156
subTotal0.01971100.000000.34159
total5.76893100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.