Chemical content 74LVC1G18GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G18GW-Q100SOT363-2SC-885.76957 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301509125712601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12752
PolymerResin systemProprietary0.0024525.000000.04251
DieDoped siliconSilicon (Si)7440-21-30.12074100.000002.09268
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.41553
Iron (Fe)7439-89-60.048742.310000.84479
Lead (Pb)7439-92-10.000210.010000.00366
Phosphorus (P)7723-14-00.001480.070000.02560
Zinc (Zn)7440-66-60.002530.120000.04389
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23771
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.61929
Silica fused60676-86-02.2159070.5700038.40664
PigmentCarbon black1333-86-40.006280.200000.10885
PolymerEpoxy resin systemProprietary0.291719.290005.05594
Phenolic resinProprietary0.186525.940003.23275
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.41231
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0190299.990000.32959
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.