Chemical content 74LVC1G74DC-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G74DC-Q100SOT765-1VSSOP89.97220 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352992931251012601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000361.000000.00359
FillerSilver (Ag)7440-22-40.0268875.000000.26955
PolymerAcrylic resinProprietary0.002156.000000.02156
Resin systemProprietary0.0064518.000000.06469
DieDoped siliconSilicon (Si)7440-21-30.11941100.000001.19745
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.08025
Nickel (Ni)7440-02-00.105113.000001.05403
Mould CompoundFillerSilica -amorphous-7631-86-90.037090.600000.37197
Silica fused60676-86-04.8426078.3300048.56096
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.377126.100003.78172
PigmentCarbon black1333-86-40.012360.200000.12399
PolymerEpoxy resin systemProprietary0.547888.862005.49403
Phenolic resinProprietary0.365255.908003.66269
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03097
Nickel (Ni)7440-02-00.0950292.300000.95288
Palladium (Pd)7440-05-30.003193.100000.03200
Silver (Ag)7440-22-40.001651.600000.01652
WirePure metalCopper (Cu)7440-50-80.02804100.000000.28116
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.