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Chemical content 74LVC2244ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVC2244ABQSOT764-1DHVQFN2027.98609 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352730001152312601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24408
PolymerResin systemProprietary0.0169719.900000.06064
subTotal0.08528100.000000.30472
DieDoped siliconSilicon (Si)7440-21-30.29821100.000001.06555
subTotal0.29821100.000001.06555
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.83723
Iron (Fe)7439-89-60.260742.400000.93166
Phosphorus (P)7723-14-00.003260.030000.01165
Zinc (Zn)7440-66-60.010860.100000.03882
subTotal10.86402100.0000038.81936
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70267
FillerSilica -amorphous-7631-86-90.571483.490002.04203
Silica fused60676-86-013.8892084.8200049.62894
PigmentCarbon black1333-86-40.026200.160000.09362
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63192
Epoxy resin systemProprietary0.260361.590000.93032
Phenolic resinProprietary0.368442.250001.31649
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16490
subTotal16.37491100.0000058.51089
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509591.000000.89670
Palladium (Pd)7440-05-30.022068.000000.07883
subTotal0.27577100.000000.98538
WirePure metalCopper (Cu)7440-50-80.0848896.550000.30328
Pure metal layerGold (Au)7440-57-50.000310.350000.00110
Palladium (Pd)7440-05-30.002733.100000.00974
subTotal0.08791100.000000.31412
total27.98609100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.