Chemical content 74LVC273BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC273BQ-Q100SOT764-1DHVQFN2028.33254 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935302459115512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00301
FillerSilver (Ag)7440-22-40.0639675.000000.22575
PolymerAcrylic resinProprietary0.005126.000000.01806
Resin systemProprietary0.0153518.000000.05418
DieDoped siliconSilicon (Si)7440-21-30.29554100.000001.04310
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.05448
Iron (Fe)7439-89-60.258502.400000.91239
Phosphorus (P)7723-14-00.003230.030000.01140
Zinc (Zn)7440-66-60.010770.100000.03802
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68185
FillerSilica -amorphous-7631-86-90.571483.490002.01706
Silica fused60676-86-013.8892184.8200049.02210
PigmentCarbon black1333-86-40.026200.160000.09247
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62419
Epoxy resin systemProprietary0.260361.590000.91895
Phenolic resinProprietary0.368442.250001.30040
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13843
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07604
Nickel (Ni)7440-02-00.6628292.300002.33945
Palladium (Pd)7440-05-30.022263.100000.07857
Silver (Ag)7440-22-40.011491.600000.04055
WirePure metalCopper (Cu)7440-50-80.0846796.550000.29885
Pure metal layerGold (Au)7440-57-50.000310.350000.00108
Palladium (Pd)7440-05-30.002723.100000.00960
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.