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Chemical content 74LVC2G74DC-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC2G74DC-Q100SOT765-1VSSOP89.97220 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300077125912601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28788
PolymerResin systemProprietary0.0071319.900000.07152
subTotal0.03584100.000000.35940
DieDoped siliconSilicon (Si)7440-21-30.11941100.000001.19745
subTotal0.11941100.000001.19745
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.08025
Nickel (Ni)7440-02-00.105113.000001.05403
subTotal3.50366100.0000035.13428
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.91378
FillerSilica fused60676-86-04.8840279.0000048.97632
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71972
PigmentCarbon black1333-86-40.012360.200000.12399
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47981
Non hazardousProprietary0.253474.100002.54181
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23991
subTotal6.18230100.0000061.99534
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03097
Nickel (Ni)7440-02-00.0950292.300000.95288
Palladium (Pd)7440-05-30.003193.100000.03200
Silver (Ag)7440-22-40.001651.600000.01652
subTotal0.10295100.000001.03237
WirePure metalCopper (Cu)7440-50-80.02804100.000000.28116
subTotal0.02804100.000000.28116
total9.97220100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.