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Chemical content 74LVC32ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC32ABQ-Q100SOT762-1DHVQFN1418.11747 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299312115412601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10284
PolymerResin systemProprietary0.0046319.900000.02555
subTotal0.02326100.000000.12839
DieDoped siliconSilicon (Si)7440-21-30.13980100.000000.77163
subTotal0.13980100.000000.77163
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.22766
Iron (Fe)7439-89-60.166072.400000.91666
Phosphorus (P)7723-14-00.002080.030000.01146
Zinc (Zn)7440-66-60.006920.100000.03819
subTotal6.91978100.0000038.19397
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68971
FillerSilica -amorphous-7631-86-90.367153.490002.02649
Silica fused60676-86-08.9230784.8200049.25121
PigmentCarbon black1333-86-40.016830.160000.09290
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62711
Epoxy resin systemProprietary0.167271.590000.92324
Phenolic resinProprietary0.236702.250001.30648
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14843
subTotal10.52001100.0000058.06557
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07640
Nickel (Ni)7440-02-00.4258792.300002.35062
Palladium (Pd)7440-05-30.014303.100000.07895
Silver (Ag)7440-22-40.007381.600000.04075
subTotal0.46140100.000002.54672
WirePure metalCopper (Cu)7440-50-80.0513896.550000.28361
Pure metal layerGold (Au)7440-57-50.000190.350000.00103
Palladium (Pd)7440-05-30.001653.100000.00911
subTotal0.05322100.000000.29375
total18.11747100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.