Chemical content 74LVC32APW

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Type numberPackagePackage descriptionTotal product weight
74LVC32APWSOT402-1TSSOP1451.78080 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352500801181912601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.06018
PolymerAcrylic resinProprietary0.0060815.200000.01174
Resin systemProprietary0.002766.900000.00533
DieDoped siliconSilicon (Si)7440-21-30.13980100.000000.26998
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.78127
Iron (Fe)7439-89-60.468962.400000.90566
Phosphorus (P)7723-14-00.005860.030000.01132
Zinc (Zn)7440-66-60.019540.100000.03774
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.36709
Silica fused60676-86-024.8149478.3300047.92306
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.73204
PigmentCarbon black1333-86-40.063360.200000.12236
PolymerEpoxy resin systemProprietary2.807488.862005.42186
Phenolic resinProprietary1.871655.908003.61457
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00560
Nickel (Ni)7440-02-00.2813097.000000.54325
Palladium (Pd)7440-05-30.005802.000000.01120
WirePure metalCopper (Cu)7440-50-80.09100100.000000.17574
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.