Chemical content 74LVC373ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC373ABQ-Q100SOT764-1DHVQFN2028.03083 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301363115512601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00304
FillerSilver (Ag)7440-22-40.0639675.000000.22818
PolymerAcrylic resinProprietary0.005126.000000.01825
Resin systemProprietary0.0153518.000000.05476
DieDoped siliconSilicon (Si)7440-21-30.34464100.000001.22951
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.77610
Iron (Fe)7439-89-60.260732.400000.93016
Phosphorus (P)7723-14-00.003260.030000.01163
Zinc (Zn)7440-66-60.010860.100000.03876
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69995
FillerSilica -amorphous-7631-86-90.571483.490002.03877
Silica fused60676-86-013.8892184.8200049.54975
PigmentCarbon black1333-86-40.026200.160000.09347
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63091
Epoxy resin systemProprietary0.260361.590000.92884
Phenolic resinProprietary0.368442.250001.31439
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16145
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00984
Nickel (Ni)7440-02-00.2509691.000000.89530
Palladium (Pd)7440-05-30.022068.000000.07871
WirePure metalCopper (Cu)7440-50-80.0834296.550000.29761
Pure metal layerGold (Au)7440-57-50.000300.350000.00108
Palladium (Pd)7440-05-30.002683.100000.00956
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.