Chemical content 74LVC3G17DC

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Type numberPackagePackage descriptionTotal product weight
74LVC3G17DCSOT765-1VSSOP89.97858 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352755631251212601235Ayutthaya, Thailand; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28769
PolymerResin systemProprietary0.0071319.900000.07147
DieDoped siliconSilicon (Si)7440-21-30.12576100.000001.26032
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.05846
Nickel (Ni)7440-02-00.105113.000001.05335
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.91192
FillerSilica fused60676-86-04.8840279.0000048.94501
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71734
PigmentCarbon black1333-86-40.012360.200000.12391
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47823
Non hazardousProprietary0.253474.100002.54018
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23911
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03095
Nickel (Ni)7440-02-00.0950292.300000.95227
Palladium (Pd)7440-05-30.003193.100000.03198
Silver (Ag)7440-22-40.001651.600000.01651
WirePure metalCopper (Cu)7440-50-80.02807100.000000.28125
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.