Chemical content 74LVC4066BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC4066BQ-Q100SOT762-1DHVQFN1418.03131 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935299339115412601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10333
PolymerResin systemProprietary0.0046319.900000.02567
DieDoped siliconSilicon (Si)7440-21-30.27988100.000001.55219
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8028397.4700037.72788
Iron (Fe)7439-89-60.167512.400000.92897
Phosphorus (P)7723-14-00.002090.030000.01161
Zinc (Zn)7440-66-60.006980.100000.03871
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69778
FillerSilica -amorphous-7631-86-90.367153.490002.03617
Silica fused60676-86-08.9230784.8200049.48655
PigmentCarbon black1333-86-40.016830.160000.09335
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63010
Epoxy resin systemProprietary0.167271.590000.92765
Phenolic resinProprietary0.236702.250001.31272
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.15869
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00983
Nickel (Ni)7440-02-00.1612391.000000.89419
Palladium (Pd)7440-05-30.014178.000000.07861
WirePure metalCopper (Cu)7440-50-80.0497996.550000.27615
Pure metal layerGold (Au)7440-57-50.000180.350000.00100
Palladium (Pd)7440-05-30.001603.100000.00887
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.