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Chemical content 74LVC573APW

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Type numberPackagePackage descriptionTotal product weight
74LVC573APWSOT360-1TSSOP2068.73494 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352190201182112601235Shanghai, China; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0623277.900000.09067
PolymerAcrylic resinProprietary0.0121615.200000.01769
Resin systemProprietary0.005526.900000.00803
subTotal0.08000100.000000.11639
DieDoped siliconSilicon (Si)7440-21-30.30232100.000000.43983
subTotal0.30232100.000000.43983
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.8258297.4700043.39252
Iron (Fe)7439-89-60.734402.400001.06845
Phosphorus (P)7723-14-00.009180.030000.01336
Zinc (Zn)7440-66-60.030600.100000.04452
subTotal30.60000100.0000044.51885
Mould CompoundFillerSilica -amorphous-7631-86-90.223080.600000.32455
Silica fused60676-86-029.1230978.3300042.37015
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.267986.100003.29960
PigmentCarbon black1333-86-40.074360.200000.10818
PolymerEpoxy resin systemProprietary3.294898.862004.79362
Phenolic resinProprietary2.196595.908003.19575
subTotal37.18000100.0000054.09185
Pre-PlatingPure metal layerGold (Au)7440-57-50.004601.000000.00669
Nickel (Ni)7440-02-00.4462097.000000.64916
Palladium (Pd)7440-05-30.009202.000000.01338
subTotal0.46000100.000000.66923
WirePure metalCopper (Cu)7440-50-80.11262100.000000.16385
subTotal0.11262100.000000.16385
total68.73494100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.