Chemical content 74LVC574ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC574ABQ-Q100SOT764-1DHVQFN2027.99027 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691607115312601235Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00305
FillerSilver (Ag)7440-22-40.0639675.000000.22851
PolymerAcrylic resinProprietary0.005126.000000.01828
Resin systemProprietary0.0153518.000000.05484
DieDoped siliconSilicon (Si)7440-21-30.30232100.000001.08008
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.83084
Iron (Fe)7439-89-60.260732.400000.93151
Phosphorus (P)7723-14-00.003260.030000.01164
Zinc (Zn)7440-66-60.010860.100000.03881
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70241
FillerSilica -amorphous-7631-86-90.571483.490002.04173
Silica fused60676-86-013.8892184.8200049.62155
PigmentCarbon black1333-86-40.026200.160000.09360
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63182
Epoxy resin systemProprietary0.260361.590000.93018
Phenolic resinProprietary0.368442.250001.31630
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16458
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509691.000000.89660
Palladium (Pd)7440-05-30.022068.000000.07882
WirePure metalCopper (Cu)7440-50-80.0851296.550000.30409
Pure metal layerGold (Au)7440-57-50.000310.350000.00110
Palladium (Pd)7440-05-30.002733.100000.00976
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.