Chemical content 74LVC74AD-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC74AD-Q100SOT108-1SO14141.60774 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300463118612601235Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01650
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
DieDoped siliconSilicon (Si)7440-21-30.18577100.000000.13119
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.71852
Iron (Fe)7439-89-61.175702.400000.83025
Phosphorus (P)7723-14-00.014700.030000.01038
Zinc (Zn)7440-66-60.048990.100000.03459
Mould CompoundFillerSilica -amorphous-7631-86-90.546510.600000.38593
Silica fused60676-86-071.3464978.3300050.38318
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.556156.100003.92362
PigmentCarbon black1333-86-40.182170.200000.12864
PolymerEpoxy resin systemProprietary8.071918.862005.70019
Phenolic resinProprietary5.381275.908003.80013
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02634
Nickel (Ni)7440-02-01.1477892.300000.81053
Palladium (Pd)7440-05-30.038553.100000.02722
Silver (Ag)7440-22-40.019901.600000.01405
WirePure metalCopper (Cu)7440-50-80.07652100.000000.05404
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.