Chemical content 74LVC74APW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC74APW-Q100SOT402-1TSSOP1459.63861 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300464118712601235Suzhou, China; Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02612
PolymerAcrylic resinProprietary0.0030415.200000.00510
Resin systemProprietary0.001386.900000.00231
DieDoped siliconSilicon (Si)7440-21-30.18577100.000000.31149
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.49121
Iron (Fe)7439-89-60.462442.400000.77541
Phosphorus (P)7723-14-00.005780.030000.00969
Zinc (Zn)7440-66-60.019270.100000.03231
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39840
Silica fused60676-86-031.0186878.3300052.01107
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.05040
PigmentCarbon black1333-86-40.079200.200000.13280
PolymerEpoxy resin systemProprietary3.509358.862005.88436
Phenolic resinProprietary2.339575.908003.92291
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02460
Nickel (Ni)7440-02-00.4514692.300000.75699
Palladium (Pd)7440-05-30.015163.100000.02542
Silver (Ag)7440-22-40.007831.600000.01312
WirePure metalCopper (Cu)7440-50-80.07531100.000000.12628
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.