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Chemical content 74LVC8T245BQ

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Type numberPackagePackage descriptionTotal product weight
74LVC8T245BQSOT815-1DHVQFN2450.51651 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935290138118712601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.20168
PolymerResin systemProprietary0.0253119.900000.05010
subTotal0.12719100.000000.25178
DieDoped siliconSilicon (Si)7440-21-30.68115100.000001.34838
subTotal0.68115100.000001.34838
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.76650
Iron (Fe)7439-89-60.469762.400000.92992
Phosphorus (P)7723-14-00.005870.030000.01162
Zinc (Zn)7440-66-60.019570.100000.03875
subTotal19.57353100.0000038.74679
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.69948
FillerSilica -amorphous-7631-86-91.029633.490002.03821
Silica fused60676-86-025.0239484.8200049.53617
PigmentCarbon black1333-86-40.047200.160000.09344
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.63074
Epoxy resin systemProprietary0.469091.590000.92858
Phenolic resinProprietary0.663802.250001.31403
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.16086
subTotal29.50241100.0000058.40151
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00984
Nickel (Ni)7440-02-00.4521491.000000.89504
Palladium (Pd)7440-05-30.039758.000000.07868
subTotal0.49686100.000000.98356
WirePure metalCopper (Cu)7440-50-80.1307096.550000.25872
Pure metal layerGold (Au)7440-57-50.000470.350000.00094
Palladium (Pd)7440-05-30.004203.100000.00831
subTotal0.13537100.000000.26797
total50.51651100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.