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Chemical content 74LVC8T245BZ

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Type numberPackagePackage descriptionTotal product weight
74LVC8T245BZSOT8024-1DHXQFN2411.87089 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691146115612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0231760.000000.19515
ImpurityNon hazardousProprietary0.000020.039500.00013
PolymerResin systemProprietary0.0154339.951410.12994
subTotal0.03861100.000000.32522
DieDoped siliconSilicon (Si)7440-21-30.30652100.000002.58210
subTotal0.30652100.000002.58210
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-85.4502297.0000045.91245
Nickel (Ni)7440-02-00.168563.000001.41997
subTotal5.61878100.0000047.33242
Mould CompoundAdditiveNon hazardousProprietary0.170192.900001.43371
FillerSilica fused60676-86-05.2202588.9500043.97525
PigmentCarbon black1333-86-40.008800.150000.07416
PolymerEpoxy resin systemProprietary0.086271.470000.72674
Phenolic resinProprietary0.182523.110001.53753
Tetramethylbiphenyl diglycidyl ether85954-11-60.200713.420001.69079
subTotal5.86875100.0000049.43818
Pre-PlatingPure metal layerGold (Au)7440-57-50.000291.000000.00247
Nickel (Ni)7440-02-00.0267391.000000.22514
Palladium (Pd)7440-05-30.002358.000000.01979
subTotal0.02937100.000000.24740
WirePure metalCopper (Cu)7440-50-80.0085596.550000.07204
Pure metal layerGold (Au)7440-57-50.000030.350000.00026
Palladium (Pd)7440-05-30.000273.100000.00231
subTotal0.00886100.000000.07461
total11.87089100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.