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Chemical content 74LVCH245ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVCH245ABQ-Q100SOT764-1DHVQFN2028.09633 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299492115612601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24313
PolymerResin systemProprietary0.0169719.900000.06040
subTotal0.08528100.000000.30353
DieDoped siliconSilicon (Si)7440-21-30.41164100.000001.46511
subTotal0.41164100.000001.46511
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.68804
Iron (Fe)7439-89-60.260732.400000.92799
Phosphorus (P)7723-14-00.003260.030000.01160
Zinc (Zn)7440-66-60.010860.100000.03867
subTotal10.86381100.0000038.66630
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69599
FillerSilica -amorphous-7631-86-90.571483.490002.03402
Silica fused60676-86-013.8892184.8200049.43424
PigmentCarbon black1333-86-40.026200.160000.09325
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62944
Epoxy resin systemProprietary0.260361.590000.92667
Phenolic resinProprietary0.368442.250001.31133
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.15641
subTotal16.37492100.0000058.28135
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00982
Nickel (Ni)7440-02-00.2509691.000000.89321
Palladium (Pd)7440-05-30.022068.000000.07852
subTotal0.27578100.000000.98155
WirePure metalCopper (Cu)7440-50-80.0819796.550000.29175
Pure metal layerGold (Au)7440-57-50.000300.350000.00106
Palladium (Pd)7440-05-30.002633.100000.00937
subTotal0.08490100.000000.30218
total28.09633100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.