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Chemical content 74LVCH2T45DC-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVCH2T45DC-Q100SOT765-1VSSOP89.98856 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301408125712601235Ayutthaya, Thailand; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28741
PolymerResin systemProprietary0.0071319.900000.07140
subTotal0.03584100.000000.35881
DieDoped siliconSilicon (Si)7440-21-30.16077100.000001.60954
subTotal0.16077100.000001.60954
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.02443
Nickel (Ni)7440-02-00.105113.000001.05230
subTotal3.50366100.0000035.07673
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.90901
FillerSilica fused60676-86-04.8840279.0000048.89611
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.71363
PigmentCarbon black1333-86-40.012360.200000.12379
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.47575
Non hazardousProprietary0.253474.100002.53765
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23788
subTotal6.18230100.0000061.89382
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03092
Nickel (Ni)7440-02-00.0950292.300000.95132
Palladium (Pd)7440-05-30.003193.100000.03195
Silver (Ag)7440-22-40.001651.600000.01649
subTotal0.10295100.000001.03068
WirePure metalCopper (Cu)7440-50-80.00304100.000000.03046
subTotal0.00304100.000000.03046
total9.98856100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.