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Chemical content 74LVCH8T245BQ

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Type numberPackagePackage descriptionTotal product weight
74LVCH8T245BQSOT815-1DHVQFN2450.51424 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352901481181112601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.20168
PolymerResin systemProprietary0.0253119.900000.05011
subTotal0.12719100.000000.25179
DieDoped siliconSilicon (Si)7440-21-30.68115100.000001.34844
subTotal0.68115100.000001.34844
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.76820
Iron (Fe)7439-89-60.469762.400000.92996
Phosphorus (P)7723-14-00.005870.030000.01162
Zinc (Zn)7440-66-60.019570.100000.03875
subTotal19.57353100.0000038.74853
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.69956
FillerSilica -amorphous-7631-86-91.029633.490002.03830
Silica fused60676-86-025.0239484.8200049.53840
PigmentCarbon black1333-86-40.047200.160000.09345
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.63076
Epoxy resin systemProprietary0.469091.590000.92863
Phenolic resinProprietary0.663802.250001.31409
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.16095
subTotal29.50241100.0000058.40414
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00984
Nickel (Ni)7440-02-00.4521491.000000.89508
Palladium (Pd)7440-05-30.039758.000000.07869
subTotal0.49686100.000000.98361
WirePure metalCopper (Cu)7440-50-80.1285096.550000.25439
Pure metal layerGold (Au)7440-57-50.000470.350000.00092
Palladium (Pd)7440-05-30.004133.100000.00817
subTotal0.13310100.000000.26348
total50.51424100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.