Chemical content 74LVCV2G66DC

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Type number	Package	Package description	Total product weight
74LVCV2G66DC	SOT765-1	VSSOP8	10.04111 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935274432125	12	1	260		1	235			Suzhou, China; Nijmegen, Netherlands; Ayutthaya, Thailand; Bangkok, Thailand

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.02871	80.10000	0.28590
	Polymer	Resin system	Proprietary	0.00713	19.90000	0.07103
		subTotal		0.03584	100.00000	0.35693

Die	Doped silicon	Silicon (Si)	7440-21-3	0.19013	100.00000	1.89350
		subTotal		0.19013	100.00000	1.89350

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	3.39855	97.00000	33.84636
		Nickel (Ni)	7440-02-0	0.10511	3.00000	1.04679
		subTotal		3.50366	100.00000	34.89315

Mould Compound	Additive	Non hazardous	Proprietary	0.29057	4.70000	2.89378
	Filler	Silica fused	60676-86-0	4.88402	79.00000	48.64021
	Flame retardant	Magnesium Hydroxide (Mg(OH)2)	1309-42-8	0.37094	6.00000	3.69419
	Pigment	Carbon black	1333-86-4	0.01236	0.20000	0.12314
	Polymer	1,4-Bis(methoxymethyl)benzene/phenol copolymer	26834-02-6	0.24729	4.00000	2.46280
		Non hazardous	Proprietary	0.25347	4.10000	2.52437
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	0.12365	2.00000	1.23140
		subTotal		6.18230	100.00000	61.56989

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.00309	3.00000	0.03076
		Nickel (Ni)	7440-02-0	0.09502	92.30000	0.94634
		Palladium (Pd)	7440-05-3	0.00319	3.10000	0.03178
		Silver (Ag)	7440-22-4	0.00165	1.60000	0.01640
		subTotal		0.10295	100.00000	1.02528

Wire	Pure metal	Copper (Cu)	7440-50-8	0.02623	100.00000	0.26128
		subTotal		0.02623	100.00000	0.26128

		total		10.04111	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.