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Chemical content 74LVT14BQ

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Type numberPackagePackage descriptionTotal product weight
74LVT14BQSOT762-1DHVQFN1417.95275 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855991151012601235D-22529 HAMBURG, Germany; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10378
PolymerResin systemProprietary0.0046319.900000.02578
subTotal0.02326100.000000.12956
DieDoped siliconSilicon (Si)7440-21-30.20143100.000001.12199
subTotal0.20143100.000001.12199
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.89376
Iron (Fe)7439-89-60.167512.400000.93306
Phosphorus (P)7723-14-00.002090.030000.01166
Zinc (Zn)7440-66-60.006980.100000.03888
subTotal6.97956100.0000038.87736
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70521
FillerSilica -amorphous-7631-86-90.367153.490002.04508
Silica fused60676-86-08.9230684.8200049.70305
PigmentCarbon black1333-86-40.016830.160000.09376
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63286
Epoxy resin systemProprietary0.167271.590000.93171
Phenolic resinProprietary0.236702.250001.31846
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16814
subTotal10.52000100.0000058.59827
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00987
Nickel (Ni)7440-02-00.1612391.000000.89808
Palladium (Pd)7440-05-30.014178.000000.07895
subTotal0.17718100.000000.98690
WirePure metalCopper (Cu)7440-50-80.0495696.550000.27608
Pure metal layerGold (Au)7440-57-50.000180.350000.00100
Palladium (Pd)7440-05-30.001593.100000.00886
subTotal0.05134100.000000.28594
total17.95275100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.