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Chemical content 74LVT162373DGG

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Type numberPackagePackage descriptionTotal product weight
74LVT162373DGGSOT362-1TSSOP48194.88279 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352641641181712601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-47.3692080.100003.78135
PolymerResin systemProprietary1.8308019.900000.93944
subTotal9.20000100.000004.72079
DieDoped siliconSilicon (Si)7440-21-31.13652100.000000.58318
subTotal1.13652100.000000.58318
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.6500097.0000022.39808
Nickel (Ni)7440-02-01.350003.000000.69272
subTotal45.00000100.0000023.09080
Mould CompoundAdditiveNon hazardousProprietary6.392004.700003.27992
FillerSilica fused60676-86-0107.4400079.0000055.13057
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-88.160006.000004.18713
PigmentCarbon black1333-86-40.272000.200000.13957
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-65.440004.000002.79142
Non hazardousProprietary5.576004.100002.86121
Tetramethylbiphenyl diglycidyl ether85954-11-62.720002.000001.39571
subTotal136.00000100.0000069.78553
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.01642
Nickel (Ni)7440-02-03.1040097.000001.59275
Palladium (Pd)7440-05-30.064002.000000.03284
subTotal3.20000100.000001.64201
WirePure metalCopper (Cu)7440-50-80.34628100.000000.17768
subTotal0.34628100.000000.17768
total194.88279100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.