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Chemical content 74LVT244ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVT244ABQ-Q100SOT764-1DHVQFN2028.47756 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935302078115412601235D-22529 HAMBURG, Germany; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.23987
PolymerResin systemProprietary0.0169719.900000.05959
subTotal0.08528100.000000.29946
DieDoped siliconSilicon (Si)7440-21-30.42913100.000001.50690
subTotal0.42913100.000001.50690
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.86578
Iron (Fe)7439-89-60.258502.400000.90774
Phosphorus (P)7723-14-00.003230.030000.01135
Zinc (Zn)7440-66-60.010770.100000.03782
subTotal10.77098100.0000037.82269
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67328
FillerSilica -amorphous-7631-86-90.571483.490002.00679
Silica fused60676-86-013.8892184.8200048.77246
PigmentCarbon black1333-86-40.026200.160000.09200
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62101
Epoxy resin systemProprietary0.260361.590000.91427
Phenolic resinProprietary0.368442.250001.29378
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.12754
subTotal16.37492100.0000057.50113
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07565
Nickel (Ni)7440-02-00.6628292.300002.32753
Palladium (Pd)7440-05-30.022263.100000.07817
Silver (Ag)7440-22-40.011491.600000.04035
subTotal0.71812100.000002.52170
WirePure metalCopper (Cu)7440-50-80.0957196.550000.33608
Pure metal layerGold (Au)7440-57-50.000350.350000.00122
Palladium (Pd)7440-05-30.003073.100000.01079
subTotal0.09913100.000000.34809
total28.47756100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.