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Chemical content 74LVTH244ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVTH244ABQSOT764-1DHVQFN2028.12835 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352856031151012601235Suzhou, China; Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24285
PolymerResin systemProprietary0.0169719.900000.06033
subTotal0.08528100.000000.30318
DieDoped siliconSilicon (Si)7440-21-30.42913100.000001.52561
subTotal0.42913100.000001.52561
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.64586
Iron (Fe)7439-89-60.260742.400000.92695
Phosphorus (P)7723-14-00.003260.030000.01159
Zinc (Zn)7440-66-60.010860.100000.03862
subTotal10.86402100.0000038.62302
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69406
FillerSilica -amorphous-7631-86-90.571483.490002.03170
Silica fused60676-86-013.8892084.8200049.37794
PigmentCarbon black1333-86-40.026200.160000.09314
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62872
Epoxy resin systemProprietary0.260361.590000.92562
Phenolic resinProprietary0.368442.250001.30984
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.15395
subTotal16.37491100.0000058.21497
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00980
Nickel (Ni)7440-02-00.2509591.000000.89216
Palladium (Pd)7440-05-30.022068.000000.07843
subTotal0.27577100.000000.98039
WirePure metalCopper (Cu)7440-50-80.0958296.550000.34065
Pure metal layerGold (Au)7440-57-50.000350.350000.00123
Palladium (Pd)7440-05-30.003083.100000.01094
subTotal0.09924100.000000.35282
total28.12835100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.