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Chemical content 74VHC02D-Q100

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Type numberPackagePackage descriptionTotal product weight
74VHC02D-Q100SOT108-1SO14141.71111 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301305118612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01649
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02117
DieDoped siliconSilicon (Si)7440-21-30.28449100.000000.20076
subTotal0.28449100.000000.20076
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.69393
Iron (Fe)7439-89-61.175702.400000.82964
Phosphorus (P)7723-14-00.014700.030000.01037
Zinc (Zn)7440-66-60.048990.100000.03457
subTotal48.98742100.0000034.56851
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.02091
FillerSilica fused60676-86-071.9567679.0000050.77707
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85649
PigmentCarbon black1333-86-40.182170.200000.12855
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.57099
Non hazardousProprietary3.734464.100002.63527
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28550
subTotal91.08450100.0000064.27478
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02633
Nickel (Ni)7440-02-01.1477892.300000.80994
Palladium (Pd)7440-05-30.038553.100000.02720
Silver (Ag)7440-22-40.019901.600000.01404
subTotal1.24353100.000000.87751
WirePure metalCopper (Cu)7440-50-80.08116100.000000.05727
subTotal0.08116100.000000.05727
total141.71111100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.