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Chemical content 74VHC244D

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Type numberPackagePackage descriptionTotal product weight
74VHC244DSOT163-1SO20511.75398 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289611118712601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-410.4130080.100002.03477
PolymerResin systemProprietary2.5870019.900000.50552
subTotal13.00000100.000002.54029
DieDoped siliconSilicon (Si)7440-21-30.33954100.000000.06635
subTotal0.33954100.000000.06635
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8151.0785097.4700029.52170
Iron (Fe)7439-89-63.720002.400000.72691
Phosphorus (P)7723-14-00.046500.030000.00909
Zinc (Zn)7440-66-60.155000.100000.03029
subTotal155.00000100.0000030.28799
Mould CompoundAdditiveNon hazardousProprietary15.980004.700003.12259
FillerSilica fused60676-86-0268.6000079.0000052.48616
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-820.400006.000003.98629
PigmentCarbon black1333-86-40.680000.200000.13288
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-613.600004.000002.65753
Non hazardousProprietary13.940004.100002.72397
Tetramethylbiphenyl diglycidyl ether85954-11-66.800002.000001.32876
subTotal340.00000100.0000066.43818
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.00625
Nickel (Ni)7440-02-03.1040097.000000.60654
Palladium (Pd)7440-05-30.064002.000000.01251
subTotal3.20000100.000000.62530
WirePure metalCopper (Cu)7440-50-80.21444100.000000.04190
subTotal0.21444100.000000.04190
total511.75398100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.