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Chemical content 74VHC245BQ

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Type numberPackagePackage descriptionTotal product weight
74VHC245BQSOT764-1DHVQFN2027.92274 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352895811151012601235Bangkok, Thailand; Suzhou, China; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24464
PolymerResin systemProprietary0.0169719.900000.06078
subTotal0.08528100.000000.30542
DieDoped siliconSilicon (Si)7440-21-30.22953100.000000.82203
subTotal0.22953100.000000.82203
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.92307
Iron (Fe)7439-89-60.260742.400000.93378
Phosphorus (P)7723-14-00.003260.030000.01167
Zinc (Zn)7440-66-60.010860.100000.03891
subTotal10.86402100.0000038.90743
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70653
FillerSilica -amorphous-7631-86-90.571483.490002.04666
Silica fused60676-86-013.8892084.8200049.74153
PigmentCarbon black1333-86-40.026200.160000.09383
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63335
Epoxy resin systemProprietary0.260361.590000.93243
Phenolic resinProprietary0.368442.250001.31948
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16981
subTotal16.37491100.0000058.64362
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00988
Nickel (Ni)7440-02-00.2509591.000000.89873
Palladium (Pd)7440-05-30.022068.000000.07901
subTotal0.27577100.000000.98762
WirePure metalCopper (Cu)7440-50-80.0900196.550000.32234
Pure metal layerGold (Au)7440-57-50.000330.350000.00117
Palladium (Pd)7440-05-30.002893.100000.01035
subTotal0.09322100.000000.33386
total27.92274100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.