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Chemical content 74VHC541BQ

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Type numberPackagePackage descriptionTotal product weight
74VHC541BQSOT764-1DHVQFN2028.01784 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289517115812601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24381
PolymerResin systemProprietary0.0169719.900000.06057
subTotal0.08528100.000000.30438
DieDoped siliconSilicon (Si)7440-21-30.33003100.000001.17794
subTotal0.33003100.000001.17794
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.79435
Iron (Fe)7439-89-60.260742.400000.93061
Phosphorus (P)7723-14-00.003260.030000.01163
Zinc (Zn)7440-66-60.010860.100000.03878
subTotal10.86402100.0000038.77537
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70074
FillerSilica -amorphous-7631-86-90.571483.490002.03972
Silica fused60676-86-013.8892084.8200049.57270
PigmentCarbon black1333-86-40.026200.160000.09351
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63120
Epoxy resin systemProprietary0.260361.590000.92927
Phenolic resinProprietary0.368442.250001.31500
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16245
subTotal16.37491100.0000058.44459
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00984
Nickel (Ni)7440-02-00.2509591.000000.89568
Palladium (Pd)7440-05-30.022068.000000.07874
subTotal0.27577100.000000.98426
WirePure metalCopper (Cu)7440-50-80.0848096.550000.30266
Pure metal layerGold (Au)7440-57-50.000310.350000.00110
Palladium (Pd)7440-05-30.002723.100000.00972
subTotal0.08783100.000000.31348
total28.01784100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.