Chemical content 74VHCT595D-Q100

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Type numberPackagePackage descriptionTotal product weight
74VHCT595D-Q100SOT109-1SO16162.27890 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301309118812601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00960
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
DieDoped siliconSilicon (Si)7440-21-30.42185100.000000.25995
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.66434
Iron (Fe)7439-89-61.345162.400000.82892
Phosphorus (P)7723-14-00.016810.030000.01036
Zinc (Zn)7440-66-60.056050.100000.03454
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38544
Silica fused60676-86-081.6566878.3300050.31873
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.91860
PigmentCarbon black1333-86-40.208490.200000.12848
PolymerEpoxy resin systemProprietary9.238378.862005.69290
Phenolic resinProprietary6.158915.908003.79526
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02630
Nickel (Ni)7440-02-01.3132192.300000.80923
Palladium (Pd)7440-05-30.044113.100000.02718
Silver (Ag)7440-22-40.022761.600000.01403
WirePure metalCopper (Cu)7440-50-80.11913100.000000.07341
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.