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Chemical content AXP1T34GM

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Type numberPackagePackage descriptionTotal product weight
AXP1T34GMSOT886XSON61.92153 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691627115412601235Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0221460.000001.15221
ImpurityNon hazardousProprietary0.000010.039500.00076
PolymerResin systemProprietary0.0147439.951410.76720
subTotal0.03690100.000001.92017
DieDoped siliconSilicon (Si)7440-21-30.05725100.000002.97930
subTotal0.05725100.000002.97930
Lead FrameCopper alloyCopper (Cu)7440-50-80.5232396.6970027.22973
Magnesium (Mg)7439-95-40.000270.050000.01408
Silicon (Si)7440-21-30.001340.248000.06984
Pure metal layerGold (Au)7440-57-50.000050.010000.00282
Nickel (Ni)7440-02-00.016102.975000.83776
Palladium (Pd)7440-05-30.000110.020000.00563
subTotal0.54110100.0000028.15986
Mould CompoundFillerSilica -amorphous-7631-86-90.089177.000004.64036
Silica fused60676-86-01.0572583.0000055.02147
PigmentCarbon black1333-86-40.006370.500000.33145
PolymerEpoxy resin systemProprietary0.076436.000003.97746
Phenolic resinProprietary0.044583.500002.32018
subTotal1.27380100.0000066.29092
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0120596.490000.62687
Pure metal layerGold (Au)7440-57-50.000060.500000.00325
Palladium (Pd)7440-05-30.000373.000000.01949
subTotal0.01248100.000000.64967
total1.92153100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.