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Chemical content AXP1T34GS

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Type numberPackagePackage descriptionTotal product weight
AXP1T34GSSOT1202X2SON60.86252 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691626125512601235Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0075660.000000.87650
ImpurityNon hazardousProprietary0.000000.039500.00058
PolymerResin systemProprietary0.0050339.951410.58362
subTotal0.01260100.000001.46070
DieDoped siliconSilicon (Si)7440-21-30.02862100.000003.31865
subTotal0.02862100.000003.31865
Lead FrameCopper alloyCopper (Cu)7440-50-80.2434896.6970028.22926
Magnesium (Mg)7439-95-40.000130.050000.01460
Silicon (Si)7440-21-30.000620.248000.07240
Pure metal layerGold (Au)7440-57-50.000030.010000.00292
Nickel (Ni)7440-02-00.007492.975000.86851
Palladium (Pd)7440-05-30.000050.020000.00584
subTotal0.25180100.0000029.19353
Mould CompoundFillerSilica -amorphous-7631-86-90.039527.000004.58134
Silica fused60676-86-00.4685483.0000054.32164
PigmentCarbon black1333-86-40.002820.500000.32724
PolymerEpoxy resin systemProprietary0.033876.000003.92687
Phenolic resinProprietary0.019763.500002.29067
subTotal0.56450100.0000065.44776
WireGold alloyGold (Au)7440-57-50.0049599.000000.57390
Palladium (Pd)7440-05-30.000051.000000.00580
subTotal0.00500100.000000.57970
total0.86252100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.