Chemical content AXP1T34GX

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Type number	Package	Package description	Total product weight
AXP1T34GX	SOT1226-3	X2SON5	0.61243 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935691573125	4	1	260		1	235			Bangkok, Thailand; Nijmegen, Netherlands

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silica -amorphous-	7631-86-9	0.00504	60.00000	0.82295
	Impurity	Non hazardous	Proprietary	0.00000	0.03950	0.00054
	Polymer	Resin system	Proprietary	0.00336	39.95141	0.54797
		subTotal		0.00840	100.00000	1.37146

Die	Doped silicon	Silicon (Si)	7440-21-3	0.02862	100.00000	4.67385
		subTotal		0.02862	100.00000	4.67385

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.16226	96.69700	26.49406
		Magnesium (Mg)	7439-95-4	0.00008	0.05000	0.01370
		Silicon (Si)	7440-21-3	0.00042	0.24800	0.06795
	Pure metal layer	Gold (Au)	7440-57-5	0.00002	0.01000	0.00274
		Nickel (Ni)	7440-02-0	0.00499	2.97500	0.81512
		Palladium (Pd)	7440-05-3	0.00003	0.02000	0.00548
		subTotal		0.16780	100.00000	27.39905

Mould Compound	Filler	Silica -amorphous-	7631-86-9	0.02719	7.00000	4.43936
		Silica fused	60676-86-0	0.32237	83.00000	52.63818
	Pigment	Carbon black	1333-86-4	0.00194	0.50000	0.31710
	Polymer	Epoxy resin system	Proprietary	0.02330	6.00000	3.80517
		Phenolic resin	Proprietary	0.01359	3.50000	2.21968
		subTotal		0.38840	100.00000	63.41949

Wire	Gold alloy	Gold (Au)	7440-57-5	0.01902	99.00000	3.10532
		Palladium (Pd)	7440-05-3	0.00019	1.00000	0.03137
		subTotal		0.01921	100.00000	3.13669

		total		0.61243	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.