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Chemical content BAS116GW

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Type numberPackagePackage descriptionTotal product weight
BAS116GWSOD123SOD212.04626 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070361118212601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
934070361115212601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02000100.000000.16603
subTotal0.02000100.000000.16603
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700029.33008
Iron (Fe)7439-89-60.077792.080000.64578
Phosphorus (P)7723-14-00.001500.040000.01242
Zinc (Zn)7440-66-60.004860.130000.04036
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51848
Silver (Ag)7440-22-40.060211.610000.49986
subTotal3.74000100.0000031.04698
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.94276
Triphenylphosphine603-35-00.004040.050000.03350
FillerSilica -amorphous-7631-86-95.8104072.0000048.23406
PigmentCarbon black1333-86-40.004040.050000.03350
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.0000010.04876
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.69917
subTotal8.07000100.0000066.99175
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00097
Tin solderTin (Sn)7440-31-50.2098799.940001.74223
subTotal0.21000100.000001.74328
WirePure metalCopper (Cu)7440-50-80.00626100.000000.05195
subTotal0.00626100.000000.05195
total12.04626100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.