Bipolar transistors


ESD protection, TVS, filtering and signal conditioning





Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS116QA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS116QASOT1215DFN1010D-31.12084 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934069886147412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000331.000000.02944
FillerSilver (Ag)7440-22-40.0277284.000002.47315
PolymerBismaleimidodiphenylmethane resin 0.0033010.000000.29442
Isobornyl Methacrylate7534-94-30.001655.000000.14721
DieDoped siliconSilicon (Si)7440-21-30.02000100.000001.78438
Lead FrameCopper alloyCopper (Cu)7440-50-80.4787591.5400042.71388
Magnesium (Mg)7439-95-40.000890.170000.07932
Nickel (Ni)7440-02-00.014912.850001.32985
Silicon (Si)7440-21-30.003240.620000.28930
Pure metal layerGold (Au)7440-57-50.000370.070000.03266
Nickel (Ni)7440-02-00.022754.350002.02977
Palladium (Pd)7440-05-30.002090.400000.18665
Mould CompoundFillerSilica -amorphous-7631-86-90.1177623.0000010.50641
Silica fused60676-86-00.3072060.0000027.40802
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.015363.000001.37040
Ion trapping agentBismuth (Bi)7440-69-90.002560.500000.22840
PigmentCarbon black1333-86-40.002560.500000.22840
PolymerEpoxy resin systemProprietary0.035847.000003.19760
Phenolic resinProprietary0.030726.000002.74080
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00012
Non hazardousProprietary0.000020.055500.00144
Tin solderTin (Sn)7440-31-50.0289899.940002.58579
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0038499.990000.34257
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.