Chemical content BAS21LD

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Type numberPackagePackage descriptionTotal product weight
BAS21LDSOD882DDFN1006-20.66460 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934070978315412601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0007676.000000.11435
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0001010.470000.01575
Phenolic resinProprietary0.0001413.530000.02036
DieDoped siliconSilicon (Si)7440-21-30.04000100.000006.01866
Lead FrameCopper alloyCopper (Cu)7440-50-80.2845891.8000042.81974
Magnesium (Mg)7439-95-40.000530.170000.07930
Nickel (Ni)7440-02-00.008872.860001.33404
Silicon (Si)7440-21-30.001920.620000.28920
Pure metal layerGold (Au)7440-57-50.000190.060000.02799
Nickel (Ni)7440-02-00.012744.110001.91709
Palladium (Pd)7440-05-30.001180.380000.17725
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.0000010.34758
Silica fused60676-86-00.1794060.0000026.99368
Flame retardantMetal hydroxideProprietary0.008973.000001.34968
ImpurityBismuth (Bi)7440-69-90.001500.500000.22495
PigmentCarbon black1333-86-40.001500.500000.22495
PolymerEpoxy resin systemProprietary0.020937.000003.14926
Phenolic resinProprietary0.017946.000002.69937
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00007
Non hazardousProprietary0.000010.055500.00084
Tin solderTin (Sn)7440-31-50.0099999.940001.50376
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0046499.990000.69809
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.