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Chemical content BAS321-Q

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Type numberPackagePackage descriptionTotal product weight
BAS321-QSOD323SOD24.15831 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663623135112601235Melaka, Malaysia; Suqian, China; Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
934663623115112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Melaka, Malaysia; Dongguan, China; Suqian, China 
934663623145112601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany; Melaka, Malaysia; Suqian, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000001.44289
subTotal0.06000100.000001.44289
Lead FrameCopper alloyCopper (Cu)7440-50-81.2165195.0400029.25496
Iron (Fe)7439-89-60.032642.550000.78493
Lead (Pb)7439-92-10.000380.030000.00923
Phosphorus (P)7723-14-00.001920.150000.04617
Zinc (Zn)7440-66-60.002560.200000.06156
Pure metal layerSilver (Ag)7440-22-40.025982.030000.62487
subTotal1.28000100.0000030.78172
Mould CompoundFillerSilica fused60676-86-02.0137375.1000048.42675
PigmentCarbon black1333-86-40.008040.300000.19345
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4692517.5000011.28453
Phenol Formaldehyde resin (generic)9003-35-40.190387.100004.57829
subTotal2.68140100.0000064.48302
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00014
Non hazardousProprietary0.000070.055500.00178
Tin solderTin (Sn)7440-31-50.1332599.940003.20452
subTotal0.13333100.000003.20644
WirePure metalCopper (Cu)7440-50-80.00358100.000000.08600
subTotal0.00358100.000000.08600
total4.15831100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.