Chemical content BAS40-04W

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Type numberPackagePackage descriptionTotal product weight
BAS40-04WSOT323SC-705.48992 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340442901151412601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000001.09291
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.03023
Carbon (C)7440-44-00.000740.040000.01344
Chromium (Cr)7440-47-30.001660.090000.03023
Cobalt (Co)7440-48-40.007930.430000.14443
Iron (Fe)7439-89-60.8196644.4500014.93024
Manganese (Mn)7439-96-50.012720.690000.23176
Nickel (Ni)7440-02-00.6341534.3900011.55120
Phosphorus (P)7723-14-00.000370.020000.00672
Silicon (Si)7440-21-30.004790.260000.08733
Sulphur (S)7704-34-90.000370.020000.00672
Pure metal layerCopper (Cu)7440-50-80.3203017.370005.83438
Silver (Ag)7440-22-40.039652.150000.72216
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.78017
FillerSilica -amorphous-7631-86-92.4264072.0000044.19737
PigmentCarbon black1333-86-40.001680.050000.03069
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000009.20778
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000006.13852
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.82481
WirePure metalCopper (Cu)7440-50-80.00592100.000000.10788
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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