×

Chemical content BAS40-06W-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS40-06W-QSOT323SC-705.48914 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664408115212601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
934664408135212601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000001.09307
subTotal0.06000100.000001.09307
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.03023
Carbon (C)7440-44-00.000740.040000.01344
Chromium (Cr)7440-47-30.001660.090000.03023
Cobalt (Co)7440-48-40.007930.430000.14445
Iron (Fe)7439-89-60.8196644.4500014.93236
Manganese (Mn)7439-96-50.012720.690000.23180
Nickel (Ni)7440-02-00.6341534.3900011.55284
Phosphorus (P)7723-14-00.000370.020000.00672
Silicon (Si)7440-21-30.004790.260000.08734
Sulphur (S)7704-34-90.000370.020000.00672
Pure metal layerCopper (Cu)7440-50-80.3203017.370005.83521
Silver (Ag)7440-22-40.039652.150000.72226
subTotal1.84400100.0000033.59360
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.78042
Triphenylphosphine603-35-00.001680.050000.03070
FillerSilica -amorphous-7631-86-92.4264072.0000044.20365
PigmentCarbon black1333-86-40.001680.050000.03070
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000009.20909
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000006.13940
subTotal3.37000100.0000061.39396
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.82535
subTotal0.21000100.000003.82573
WirePure metalCopper (Cu)7440-50-80.00514100.000000.09365
subTotal0.00514100.000000.09365
total5.48914100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.