Chemical content BAS40

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Type numberPackagePackage descriptionTotal product weight
BAS40SOT23TO-236AB7.64691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340345302351712601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
9340345302151512601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03000100.000000.39232
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.03000
Carbon (C)7440-44-00.001020.040000.01333
Chromium (Cr)7440-47-30.005610.220000.07333
Cobalt (Co)7440-48-40.010960.430000.14334
Iron (Fe)7439-89-61.2230147.9800015.99352
Manganese (Mn)7439-96-50.021920.860000.28667
Nickel (Ni)7440-02-00.9212136.1400012.04681
Phosphorus (P)7723-14-00.000510.020000.00667
Silicon (Si)7440-21-30.006630.260000.08667
Sulphur (S)7704-34-90.000510.020000.00667
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.79004
Silver (Ag)7440-22-40.065512.570000.85668
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.85030
FillerSilica -amorphous-7631-86-93.5128872.0000045.93856
PigmentCarbon black1333-86-40.002440.050000.03190
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.57053
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.38035
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00007
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000010.005000.00012
Tin solderTin (Sn)7440-31-50.1849899.990002.41904
WirePure metalCopper (Cu)7440-50-80.00391100.000000.05115
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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