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Chemical content BAS516

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Type numberPackagePackage descriptionTotal product weight
BAS516SOD523SC-791.45714 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340552173151012601235Melaka, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
9340552171351212601235Dongguan, China; D-22529 HAMBURG, Germany; Melaka, Malaysia 
9340552171151312601235Melaka, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02000100.000001.37255
subTotal0.02000100.000001.37255
Lead FrameCopper alloyCopper (Cu)7440-50-80.4579786.4100031.42958
Nickel (Ni)7440-02-00.046488.770003.18988
Tin (Sn)7440-31-50.011872.240000.81475
Pure metal layerSilver (Ag)7440-22-40.013672.580000.93841
subTotal0.53000100.0000036.37262
Mould CompoundFillerSilica fused60676-86-00.6248071.0000042.87852
PigmentCarbon black1333-86-40.002640.300000.18118
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.1733619.7000011.89728
Phenolic resinProprietary0.079209.000005.43530
subTotal0.88000100.0000060.39228
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00006
Non hazardousProprietary0.000010.055500.00076
Tin solderTin (Sn)7440-31-50.0199999.940001.37173
subTotal0.02000100.000001.37255
WirePure metalGold (Au)7440-57-50.00714100.000000.49000
subTotal0.00714100.000000.49000
total1.45714100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.