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Chemical content BAS70-05W

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Type numberPackagePackage descriptionTotal product weight
BAS70-05WSOT323SC-705.47603 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340344901351412601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
9340344901151312601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000001.09568
subTotal
Lead FrameIron-nickel alloyPhosphorus (P)7723-14-00.000360.020000.00657
Nickel (Ni)7440-02-00.6397235.5400011.68219
Chromium (Cr)7440-47-30.003780.210000.06903
Sulphur (S)7704-34-90.000360.020000.00657
Manganese (Mn)7439-96-50.015300.850000.27940
Carbon (C)7440-44-00.000720.040000.01315
Aluminium (Al)7429-90-50.001620.090000.02958
Iron (Fe)7439-89-60.8490647.1700015.50503
Cobalt (Co)7440-48-40.007560.420000.13806
Silicon (Si)7440-21-30.004500.250000.08218
Pure metal layerCopper (Cu)7440-50-80.2349013.050004.28960
Silver (Ag)7440-22-40.042122.340000.76917
subTotal
Mould CompoundFillerSilica fused60676-86-02.5534075.1000046.62867
PigmentCarbon black1333-86-40.010200.300000.18627
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.86554
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.40830
subTotal
Post-PlatingImpurityCopper (Cu)7440-50-80.000000.001000.00004
Bismuth (Bi)7440-69-90.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Antimony (Sb)7440-36-00.000010.003000.00012
Tin solderTin (Sn)7440-31-50.2099899.990003.83451
subTotal
WirePure metalCopper (Cu)7440-50-80.00603100.000000.11020
subTotal
total5.47603100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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