×

Chemical content BAS70-05W

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS70-05WSOT323SC-705.47603 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340344901351412601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
9340344901151312601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000001.09568
subTotal0.06000100.000001.09568
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001620.090000.02958
Carbon (C)7440-44-00.000720.040000.01315
Chromium (Cr)7440-47-30.003780.210000.06903
Cobalt (Co)7440-48-40.007560.420000.13806
Iron (Fe)7439-89-60.8490647.1700015.50503
Manganese (Mn)7439-96-50.015300.850000.27940
Nickel (Ni)7440-02-00.6397235.5400011.68219
Phosphorus (P)7723-14-00.000360.020000.00657
Silicon (Si)7440-21-30.004500.250000.08218
Sulphur (S)7704-34-90.000360.020000.00657
Pure metal layerCopper (Cu)7440-50-80.2349013.050004.28960
Silver (Ag)7440-22-40.042122.340000.76917
subTotal1.80000100.0000032.87053
Mould CompoundFillerSilica fused60676-86-02.5534075.1000046.62867
PigmentCarbon black1333-86-40.010200.300000.18627
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.86554
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.40830
subTotal3.40000100.0000062.08878
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00012
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.83451
subTotal0.21000100.000003.83490
WirePure metalCopper (Cu)7440-50-80.00603100.000000.11020
subTotal0.00603100.000000.11020
total5.47603100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.