Chemical content BAT32ALS-Q

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Type numberPackagePackage descriptionTotal product weight
BAT32ALS-QSOD882BDDFN1006-20.89948 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663991315212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.60537
PolymerPhenolic resinProprietary0.0025713.530000.28580
Formaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22116
DieDoped siliconSilicon (Si)7440-21-30.03800100.000004.22466
Lead FrameCopper alloySilicon (Si)7440-21-30.002570.650000.28544
Nickel (Ni)7440-02-00.011772.980001.30864
Magnesium (Mg)7439-95-40.000590.150000.06587
Copper (Cu)7440-50-80.3776295.6000041.98203
Pure metal layerNickel (Ni)7440-02-00.002250.570000.25031
Gold (Au)7440-57-50.000040.010000.00439
Palladium (Pd)7440-05-30.000160.040000.01757
Mould CompoundFillerSilica fused60676-86-00.3387980.0920037.66500
Silica -amorphous-7631-86-90.033767.980003.75277
PigmentCarbon black1333-86-40.003930.928000.43641
PolymerEpoxy resin systemProprietary0.035748.450003.97380
Phenolic resinProprietary0.010792.550001.19919
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00123
Tin solderTin (Sn)7440-31-50.0199999.940002.22217
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044899.990000.49802
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.