×

Chemical content BAT32ALS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT32ALS-QSOD882BDDFN1006-20.89948 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663991315212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.60537
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22116
Phenolic resinProprietary0.0025713.530000.28580
subTotal0.01900100.000002.11233
DieDoped siliconSilicon (Si)7440-21-30.03800100.000004.22466
subTotal0.03800100.000004.22466
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.98203
Magnesium (Mg)7439-95-40.000590.150000.06587
Nickel (Ni)7440-02-00.011772.980001.30864
Silicon (Si)7440-21-30.002570.650000.28544
Pure metal layerGold (Au)7440-57-50.000040.010000.00439
Nickel (Ni)7440-02-00.002250.570000.25031
Palladium (Pd)7440-05-30.000160.040000.01757
subTotal0.39500100.0000043.91425
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.75277
Silica fused60676-86-00.3387980.0920037.66500
PigmentCarbon black1333-86-40.003930.928000.43641
PolymerEpoxy resin systemProprietary0.035748.450003.97380
Phenolic resinProprietary0.010792.550001.19919
subTotal0.42300100.0000047.02717
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00123
Tin solderTin (Sn)7440-31-50.0199999.940002.22217
subTotal0.02000100.000002.22350
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044899.990000.49802
subTotal0.00448100.000000.49807
total0.89948100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.