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Chemical content BAT54CM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT54CMdummy POV SOT883XQFN30.87561 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340572523151512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.86797
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11957
Phenolic resinProprietary0.0013513.530000.15452
subTotal0.01000100.000001.14206
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.71030
subTotal0.05000100.000005.71030
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.87236
Magnesium (Mg)7439-95-40.000630.146000.07170
Nickel (Ni)7440-02-00.012532.913001.43053
Silicon (Si)7440-21-30.002710.631000.30988
MetallisationGold (Au)7440-57-50.000150.035000.01719
Nickel (Ni)7440-02-00.011852.755001.35294
Palladium (Pd)7440-05-30.000470.110000.05402
subTotal0.43000100.0000049.10862
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.71894
Silica fused60676-86-00.2220060.0000025.35375
Flame retardantMetal hydroxideProprietary0.011103.000001.26769
ImpurityBismuth (Bi)7440-69-90.001850.500000.21128
PigmentCarbon black1333-86-40.001850.500000.21128
PolymerEpoxy resin systemProprietary0.025907.000002.95794
Phenolic resinProprietary0.022206.000002.53538
subTotal0.37000100.0000042.25626
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.14138
subTotal0.01000100.000001.14206
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalGold (Au)7440-57-50.0056199.990000.64086
subTotal0.00561100.000000.64092
total0.87561100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.