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Chemical content BAV170M

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Type numberPackagePackage descriptionTotal product weight
BAV170MSOT883XQFN30.86792 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069887315512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.87566
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12063
Phenolic resinProprietary0.0013513.530000.15589
subTotal0.01000100.000001.15218
DieDoped siliconSilicon (Si)7440-21-30.04000100.000004.60872
subTotal0.04000100.000004.60872
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100046.27880
Magnesium (Mg)7439-95-40.000630.146000.07233
Nickel (Ni)7440-02-00.012532.913001.44321
Silicon (Si)7440-21-30.002710.631000.31262
MetallisationGold (Au)7440-57-50.000150.035000.01734
Nickel (Ni)7440-02-00.011852.755001.36493
Palladium (Pd)7440-05-30.000470.110000.05450
subTotal0.43000100.0000049.54373
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.80505
Silica fused60676-86-00.2220060.0000025.57839
Flame retardantMetal hydroxideProprietary0.011103.000001.27892
ImpurityBismuth (Bi)7440-69-90.001850.500000.21315
PigmentCarbon black1333-86-40.001850.500000.21315
PolymerEpoxy resin systemProprietary0.025907.000002.98415
Phenolic resinProprietary0.022206.000002.55784
subTotal0.37000100.0000042.63065
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00064
Tin solderTin (Sn)7440-31-50.0099999.940001.15149
subTotal0.01000100.000001.15218
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0079299.990000.91244
subTotal0.00792100.000000.91253
total0.86792100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.