Chemical content BC52-10PAS

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Type numberPackagePackage descriptionTotal product weight
BC52-10PASSOT1061DHUSON37.55400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340681181153126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01456
FillerSilver (Ag)7440-22-40.0924084.000001.22319
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14562
Isobornyl Methacrylate7534-94-30.005505.000000.07281
DieDoped siliconSilicon (Si)7440-21-30.20000100.000002.64760
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400034.83285
Magnesium (Mg)7439-95-40.014020.500000.18560
Nickel (Ni)7440-02-00.103753.700001.37342
Silicon (Si)7440-21-30.022430.800000.29696
Pure metal layerGold (Au)7440-57-50.001680.060000.02227
Nickel (Ni)7440-02-00.028041.000000.37119
Palladium (Pd)7440-05-30.002800.100000.03712
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.23122
FillerSilica -amorphous-7631-86-90.012350.290000.16354
Silica fused60676-86-03.6699986.1500048.58340
HardenerPhenolic resinProprietary0.182754.290002.41930
PigmentCarbon black1333-86-40.008090.190000.10715
PolymerEpoxy resin systemProprietary0.369348.670004.88936
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00125
Tin solderTin (Sn)7440-31-50.1699099.940002.24911
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0100099.990000.13237
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.