Chemical content BC55-16PAS-Q

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Type numberPackagePackage descriptionTotal product weight
BC55-16PAS-QSOT1061DHUSON37.48400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346661341152126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01470
FillerSilver (Ag)7440-22-40.0924084.000001.23463
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14698
Isobornyl Methacrylate7534-94-30.005505.000000.07349
DieDoped siliconSilicon (Si)7440-21-30.13000100.000001.73704
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400035.15865
Magnesium (Mg)7439-95-40.014020.500000.18733
Nickel (Ni)7440-02-00.103753.700001.38626
Silicon (Si)7440-21-30.022430.800000.29973
Pure metal layerGold (Au)7440-57-50.001680.060000.02248
Nickel (Ni)7440-02-00.028041.000000.37467
Palladium (Pd)7440-05-30.002800.100000.03747
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.23338
FillerSilica -amorphous-7631-86-90.012350.290000.16507
Silica fused60676-86-03.6699986.1500049.03781
HardenerPhenolic resinProprietary0.182754.290002.44193
PigmentCarbon black1333-86-40.008090.190000.10815
PolymerEpoxy resin systemProprietary0.369348.670004.93509
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00126
Tin solderTin (Sn)7440-31-50.1699099.940002.27015
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0100099.990000.13360
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.