Chemical content BC56-10PA

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Type numberPackagePackage descriptionTotal product weight
BC56-10PASOT1061HUSON37.49157 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934065809115512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01468
FillerSilver (Ag)7440-22-40.0924084.000001.23339
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14683
Isobornyl Methacrylate7534-94-30.005505.000000.07342
DieDoped siliconSilicon (Si)7440-21-30.13000100.000001.73528
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000035.25787
Magnesium (Mg)7439-95-40.008410.300000.11229
Nickel (Ni)7440-02-00.098143.500001.31001
Silicon (Si)7440-21-30.024390.870000.32563
Pure metal layerGold (Au)7440-57-50.001120.040000.01497
Nickel (Ni)7440-02-00.028041.000000.37429
Palladium (Pd)7440-05-30.002520.090000.03369
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.23314
FillerSilica -amorphous-7631-86-90.012350.290000.16491
Silica fused60676-86-03.6699986.1500048.98826
HardenerPhenolic resinProprietary0.182754.290002.43946
PigmentCarbon black1333-86-40.008090.190000.10804
PolymerEpoxy resin systemProprietary0.369348.670004.93010
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00126
Tin solderTin (Sn)7440-31-50.1699099.940002.26786
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0175799.990000.23453
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.