Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC56-16PA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC56-16PASOT1061HUSON37.49157 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340658111155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0880080.000001.17465
PolymerAcrylic resinProprietary0.0220020.000000.29366
subTotal0.11000100.000001.46831
DieDoped siliconSilicon (Si)7440-21-30.13000100.000001.73528
subTotal0.13000100.000001.73528
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000035.25787
Magnesium (Mg)7439-95-40.008410.300000.11229
Nickel (Ni)7440-02-00.098143.500001.31001
Silicon (Si)7440-21-30.024390.870000.32563
Pure metal layerGold (Au)7440-57-50.001120.040000.01497
Nickel (Ni)7440-02-00.028041.000000.37429
Palladium (Pd)7440-05-30.002520.090000.03369
subTotal2.80400100.0000037.42875
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.23314
FillerSilica -amorphous-7631-86-90.012350.290000.16491
Silica fused60676-86-03.6699986.1500048.98826
HardenerPhenolic resinProprietary0.182754.290002.43946
PigmentCarbon black1333-86-40.008090.190000.10804
PolymerEpoxy resin systemProprietary0.369348.670004.93010
subTotal4.26000100.0000056.86391
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00126
Tin solderTin (Sn)7440-31-50.1699099.940002.26786
subTotal0.17000100.000002.26922
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0175799.990000.23453
subTotal0.01757100.000000.23455
total7.49157100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.